MoCu Carriers For High Reliability Ceramic Substrates And Critical Glass-to-metal Interfaces
Description:
Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper. Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.
Advantages:
1. This molybdenum copper base plates feature high thermal conductivity and excellent hermeticity.
2. Molybdenum copper flanges are 40% lighter than comparable tungsten copper composite.
Product Properties:
| Grade | Mo Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Advantages:
Mo/Cu offers the following advantages to our customers:
Tailored thermal expansion to meet your specific design criteria
Highest thermal/electrical conductivity performance available for this material
Outstanding thermal-mechanical stability
Critical dimensional tolerance and surface finish control
Metallization capability including electrolytic, electroless, and thin film processes to meet your specifications Finer particle size available for critical edge and thermal uniformity specification
A forty percent weight savings compared to W/Cu
Application:
Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.
Product Tags:
|
|
MoCu Carriers High Reliability Ceramic Substrates And Critical Glass To Metal Interfaces Images
|
