Efficient Cooling 80/20 Molybdenum Copper 70/30 Molybdenum Copper Heat Spreader For Instance IGBT Modular
Description:
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With reliable heat dissipation properties, our molybdenum copper heat sinks are used widely in electronic components.
Our materials can be often found in the semiconductor components like high-power transistors, for instance IGBT modules or RF amplifiers, as well as LED chips.
MoCu heat sinks combine the low thermal expansion of molybdenum and tungsten with the excellent thermal conductivity of copper. And with years of experience, we have also tailored composite materials to meet the requirements of silicon, GaAs and GaN-based semiconductor materials. So if you choose our materials, you can avoid failures resulting from overheating or mechanical damage.
Advantages:
1. This molybdenum copper base plates feature high thermal conductivity and excellent hermeticity.
2. Molybdenum copper flanges are 40% lighter than comparable tungsten copper composite.
3. If you have doubt about plating, we can give you our suggestions like nickel thickness, gold thickness.
Besides, if you are design the heat sink in your high power transistors, we can recommend the suitable material for your reference.
Product Properties:
| Grade | Mo Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.
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