Home > Heat Sink >

Cu - W Heat Spreader Material CuW Electronic Thermal Management Materials

Product Categories

Hermetic Packages Electronics [97]
Heat Sink [90]
Welding Electrodes [56]
X-Ray Tube Target [12]
Tungsten Products [33]
Molybdenum Products [23]
Tungsten Heavy Alloy [28]
Copper Tungsten Alloy [53]
Tantalum Products [15]
Niobium Products [27]
Tungsten Carbide Products [49]
High Temperature Furnace Spare Parts [20]
Molybdenum Copper [24]

Zhuzhou Jiabang Refractory Metal Co., Ltd

Contact Now

Cu - W Heat Spreader Material CuW Electronic Thermal Management Materials

Name: Cu W Heat Spreader Material CuW Electronic Thermal Management Materials
Brand: JBNR
Price: 1 USD

Quality Cu - W Heat Spreader Material CuW Electronic Thermal Management Materials for sale

Brand Name : JBNR

Model Number : 50WCu,75WCu,80WCu,85WCu,90WCu

Place of Origin : CHINA

MOQ : Negotiation

Price : Negotiable

Payment Terms : L/C, , T/T, Western Union

Delivery Time : 15days

Packaging Details : as customer required

Material : tungsten copper

Density : 14.9

CTE : 9.0

TC : 220-230

Application : Ceramic Packages

Contact Now

Cu-W Heat Spreader Material for Ceramic Packages CuW Electronic thermal management materials

Description:

Copper Tungsten is one of the most popular refractory metal based heat sink materials offered today.With the new off-the-shelf system, we are able to offer standard products with a short lead-time at extremely competitive rates.
It is an composite of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.

Advantages:

High thermal conductivity

Excellent hermeticity

Excellent flatness, surface finish, and size control

Semi-finished or finished (Ni/Au plated) products available

Product Properties:

Grade	W Content	Density g/cm³	Coefficient of thermal Expansion ×10^-6(20℃)	Thermal conductivity W/(M·K)
90WCu	90±2%	17.0	6.5	180 (25℃) /176 (100℃)
85WCu	85±2%	16.4	7.2	190 (25℃) / 183 (100℃)
80WCu	80±2%	15.65	8.3	200 (25℃) / 197 (100℃)
75WCu	75±2%	14.9	9.0	230 (25℃) / 220 (100℃)
50WCu	50±2%	12.2	12.5	340 (25℃) / 310 (100℃)

Application:

Our products are widely used in applications such as heat sink, heat spreader, shim, laser diode submount, substrates, base plate, flange, chip carrier, optical bench, etc.

Product picture:

Cu - W Heat Spreader Material CuW Electronic Thermal Management Materials

Product Tags:

copper base plate

copper block heat sink

Cu - W Heat Spreader Material CuW Electronic Thermal Management Materials Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Zhuzhou Jiabang Refractory Metal Co., Ltd
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!