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Mo50Cu Moly / Copper Heat Sink Material With High Thermal Conductivity

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Zhuzhou Jiabang Refractory Metal Co., Ltd

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Mo50Cu Moly / Copper Heat Sink Material With High Thermal Conductivity

Name: Mo50Cu Moly Copper Heat Sink Material With High Thermal Conductivity
Brand: JBNR
Price: 1 USD

Quality Mo50Cu Moly / Copper Heat Sink Material With High Thermal Conductivity for sale

Brand Name : JBNR

Model Number : 50MoCu,60MoCu,70MoCu,85MoCu

Place of Origin : CHINA

MOQ : Negotiation

Price : Negotiable

Payment Terms : L/C, , T/T, Western Union

Delivery Time : 25days

Packaging Details : as customer required

Material : Molybdenum copper

Density : 9.54

CTE : 11.5

TC : 230-270

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High Thermal Conductivity Mo50Cu Moly/Copper Heat Sink Material

Description:

Mo-Cu heat sink material is a composite of molybdenum and copper,the Coefficient of thermal expansion (CTE) of molybdenum copper can be tailored by adjusting the composition, which is the same way with tungsten copper composites. MoCu is much lighter than tungsten cooper, which make it more suitable for aerospace usage.

Advantages:

Good machinability

Good hermeticity

Good thermal conductivity

Good mechanical strength to provide excellent mechanical protection to the IC

Product Properties:

Grade	Mo Content	Density g/cm³	Coefficient of thermal Expansion ×10^-6(20℃)	Thermal conductivity W/(M·K)
85MoCu	85±2%	10.0	7	160(25℃)/156(100℃)
70MoCu	70±2%	9.8	7	200(25℃)/196(100℃)
60MoCu	60±2%	9.66	7.5	222(25℃)/217(100℃)
50MoCu	50±2%	9.5	10.2	250(25℃)/220(100℃)

Application:

These composite are widely used in applications such as IGBT modules,Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.

Product picture:

Mo50Cu Moly / Copper Heat Sink Material With High Thermal Conductivity

Product Tags:

copper base plate

copper block heat sink

Mo50Cu Moly / Copper Heat Sink Material With High Thermal Conductivity Images

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