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Mo - Cu Mo70Cu30 Heat Sink Polished Molybdenum And Copper Wafer / Disk

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Zhuzhou Jiabang Refractory Metal Co., Ltd

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Mo - Cu Mo70Cu30 Heat Sink Polished Molybdenum And Copper Wafer / Disk

Name: Mo Cu Mo70Cu30 Heat Sink Polished Molybdenum And Copper Wafer Disk
Brand: JBNR
Price: 1 USD

Brand Name : JBNR

Model Number : 50MoCu,60MoCu,70MoCu,85MoCu

Place of Origin : CHINA

MOQ : Negotiation

Price : Negotiable

Payment Terms : L/C, , T/T, Western Union

Delivery Time : 25days

Packaging Details : as customer required

Material : Molybdenum copper

Density : 9.8

CTE : 7.3

TC : 190-200

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Polished Molybdenum Copper Wafer / Disk Mo70Cu30 Heat Sink

Description:

Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.

Advantages:

1. This molybdenum copper carrier/heat sink feature high thermal conductivity and excellent hermeticity.

2. Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.

Product Properties:

Grade	Mo Content	Density g/cm³	Coefficient of thermal Expansion ×10^-6(20℃)	Thermal conductivity W/(M·K)
85MoCu	85±2%	10.0	7	160(25℃)/156(100℃)
70MoCu	70±2%	9.8	7	200(25℃)/196(100℃)
60MoCu	60±2%	9.66	7.5	222(25℃)/217(100℃)
50MoCu	50±2%	9.5	10.2	250(25℃)/220(100℃)

Application:

These composite are widely used in applications, such as, optoelectronics packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.

Product picture:

Mo - Cu Mo70Cu30 Heat Sink Polished Molybdenum And Copper Wafer / Disk

Product Tags:

copper base plate

copper block heat sink

Quality Mo - Cu Mo70Cu30 Heat Sink Polished Molybdenum And Copper Wafer / Disk for sale

Mo - Cu Mo70Cu30 Heat Sink Polished Molybdenum And Copper Wafer / Disk Images

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