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Excellent X - Y Expansion Cross Rolled Moly Copper Sheet For Supporting Cases / I / C Packaging

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Zhuzhou Jiabang Refractory Metal Co., Ltd

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Excellent X - Y Expansion Cross Rolled Moly Copper Sheet For Supporting Cases / I / C Packaging

Name: Excellent X Y Expansion Cross Rolled Moly Copper Sheet For Supporting Cases I C Packaging
Brand: JBNR
Price: 1 USD

Quality Excellent X - Y Expansion Cross Rolled Moly Copper Sheet For Supporting Cases / I / C Packaging for sale

Brand Name : JBNR

Model Number : HCMC022

Certification : ISO9001

Place of Origin : China

MOQ : 10pcs

Price : Negotiable

Payment Terms : L/C, D/A, D/P, T/T, Western Union

Supply Ability : 5 tons a month

Delivery Time : 15-20 days

Packaging Details : Wooden boxes

Grade : Mo85Cu15, Mo80Cu20, Mo75C25, Mo70Cu30, Mo60Cu40,Mo50Cu50

Surface : Grinded or lathed

Dimensions : Based on customer requirements

Plating : Nickel plating or gold plaing

Shape : Shims or sheets or fabricated parts

Test : High Temperature Tested

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Excellent X-Y Expansion Cross-rolled Moly Copper Sheet For Supporting Cases For I/C Packaging

Description:

With adjustable thermal expansion coefficient and thermal conductivity, Molybdenum Copper Sheet (MoCu) is a suitable material for heat cooling in microelectronic industry. And the density of molybdenum copper is equal or below 10.01 which is much smaller than that of tungsten copper.

For some specific industry like automobile and aerospace, Molybdenum Copper Heatsinks is a better choice.

We can provide moly copper sheet, moly copper roll, moly copper plate for your following machining, plating.

Advantages:

1. high thermal conductivity and excellent hermeticity.

2. 40% lighter weight compared to WCu materials.

Excellent X - Y Expansion Cross Rolled Moly Copper Sheet For Supporting Cases / I / C Packaging

Product Properties:

Grade	Mo Content	Density g/cm³	Coefficient of thermal Expansion ×10^-6(20℃)	Thermal conductivity W/(M·K)
85MoCu	85±2%	10.01	7	200(25℃)/156(100℃)
80MoCu	80±2%	9.9	7	170(25℃)/190(100℃)
70MoCu	70±2%	9.8	7.3	200(25℃)/196(100℃)
60MoCu	60±2%	9.66	8.4	222(25℃)/217(100℃)
50MoCu	50±2%	9.5	10.2	250(25℃)/220(100℃)

Application:

Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

Product Tags:

copper base plate

copper block heat sink

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