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Brand Name : JBNR
Model Number : HCMC025
Certification : ISO9001
Place of Origin : China
MOQ : 10pcs
Price : Based on dimensions
Payment Terms : L/C, D/A, D/P, T/T, Western Union
Supply Ability : 5 tons a month
Delivery Time : 20 days
Packaging Details : Wooden boxes
Grade : Mo80Cu20, Mo75C25, Mo70Cu30, Mo60Cu40,Mo50Cu50
Surface : Plated or unplated
Dimensions : Based on customer requirements
Plating : Nickel plating and gold plaing
Shape : Shims or sheets or fabricated parts
name : Thin Thickness Molybdenum Copper Carrier Wafer
Thin Thickness Molybdenum Copper Carrier Wafer For High Power Led
Description:
Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper. Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.
Advantages:
1. This molybdenum copper base plates feature high thermal conductivity and excellent hermeticity.
2. Molybdenum copper flanges are 40% lighter than comparable tungsten copper composite.
Product Properties:
Grade | Mo Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.
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Thin Thickness Copper Molybdenum Alloy Carrier Wafer For High Power Led Images |