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Copper Molybdenum Cu - Mo Heat Sink Copper Base Plate Composite Materials

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Zhuzhou Jiabang Refractory Metal Co., Ltd

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Copper Molybdenum Cu - Mo Heat Sink Copper Base Plate Composite Materials

Name: Copper Molybdenum Cu Mo Heat Sink Copper Base Plate Composite Materials
Brand: JBNR
Price: 1 USD

Quality Copper Molybdenum Cu - Mo Heat Sink Copper Base Plate Composite Materials for sale

Brand Name : JBNR

Model Number : 50MoCu,60MoCu,70MoCu,85MoCu

Certification : ISO9001

Place of Origin : CHINA

MOQ : Negotiation

Price : Negotiable

Payment Terms : L/C, , T/T, Western Union

Delivery Time : 25days

Packaging Details : as customer required

Material : Molybdenum copper

Density : 9.8

CTE : 7.3

TC : 190-200

Plating : Nickel and gold

name : electronic packaging materials

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Copper Molybdenum (Cu-Mo) Heat Sink Composite Materials

Description:

MoCu alloy heatsink is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter than W-Cu, so that it is more suitable for aeronautic and astronautic applications.

Advantages:

High thermal conductivity

Excellent hermeticity

Relatively small density

Stampable sheets available (Mo content not more than 75wt.%)

Semi-finished or finished (Ni/Au plated) parts available

Product Properties:

Grade	Mo Content	Density g/cm³	Coefficient of thermal Expansion ×10^-6(20℃)	Thermal conductivity W/(M·K)
85MoCu	85±2%	10.0	7	160(25℃)/156(100℃)
70MoCu	70±2%	9.8	7	200(25℃)/196(100℃)
60MoCu	60±2%	9.66	7.5	222(25℃)/217(100℃)
50MoCu	50±2%	9.5	10.2	250(25℃)/220(100℃)

Application:

These composite are widely used in applications, such as optoelectronics packages Microwave Packages, C Packages, Laser Sub-mounts, etc

Product picture:

Copper Molybdenum Cu - Mo Heat Sink Copper Base Plate Composite Materials

Product Tags:

copper base plate

copper block heat sink

Copper Molybdenum Cu - Mo Heat Sink Copper Base Plate Composite Materials Images

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