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High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material

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Zhuzhou Jiabang Refractory Metal Co., Ltd

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High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material

Name: High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material
Brand: JBNR
Price: 1 USD

Quality High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material for sale

Brand Name : JBNR

Model Number : 50MoCu,60MoCu,70MoCu,85MoCu

Certification : ISO9001

Place of Origin : CHINA

MOQ : Negotiation

Price : Negotiable

Payment Terms : L/C, , T/T, Western Union

Delivery Time : 25days

Packaging Details : as customer required

Material : Molybdenum copper

Density : 9.5

CTE : 10.2

TC : 220-250

Plating : Nickel and gold

name : electronic packaging materials

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Heat Sink Molybdenum Copper Electronic Packing Material

Description:

MoCu alloy heatsink is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter than W-Cu, so that it is more suitable for aeronautic and astronautic applications.

Advantages:

High thermal conductivity

Excellent hermeticity

Excellent flatness, surface finish, and size control

Semi-finished or finished (Ni/Au plated) products availabl

Product Properties:

Grade	Mo Content	Density g/cm³	Coefficient of thermal Expansion ×10^-6(20℃)	Thermal conductivity W/(M·K)
85MoCu	85±2%	10.0	7	160(25℃)/156(100℃)
70MoCu	70±2%	9.8	7	200(25℃)/196(100℃)
60MoCu	60±2%	9.66	7.5	222(25℃)/217(100℃)
50MoCu	50±2%	9.5	10.2	250(25℃)/220(100℃)

Application:

Our products are widely used in applications such as heat sink, heat spreader, shim, laser diode submount, substrates, base plate, flange, chip carrier, optical bench, etc.

Product picture:

High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material

Product Tags:

copper base plate

copper block heat sink

High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material Images

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