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Cu - W Semiconductor Substrate

Zhuzhou Jiabang Refractory Metal Co., Ltd
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Cu - W Semiconductor Substrate

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Brand Name : JBNR

Model Number : 50WCu,75WCu,80WCu,85WCu,90WCu

Place of Origin : CHINA

MOQ : Negotiation

Price : Negotiable

Payment Terms : L/C, , T/T, Western Union

Delivery Time : 15days

Packaging Details : as customer required

Material : tungsten copper

Density : 12.2

CTE : 12.5

TC : 310-340

Application : integrated circuit

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Cu-W semiconductor substrate tungsten copper heat sink package material for integrated circuit

Description:


CuW heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape.

Advantages:

High thermal conductivity

Excellent hermeticity

Excellent flatness, surface finish, and size control

Semi-finished or finished (Ni/Au plated) products available


Product Properties:

Grade W Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
90WCu 90±2% 17.0 6.5 180 (25℃) /176 (100℃)
85WCu 85±2% 16.4 7.2 190 (25℃) / 183 (100℃)
80WCu 80±2% 15.65 8.3 200 (25℃) / 197 (100℃)
75WCu 75±2% 14.9 9.0 230 (25℃) / 220 (100℃)
50WCu 50±2% 12.2 12.5 340 (25℃) / 310 (100℃)



Application:

Our products are widely used in applications such as heat sink, heat spreader, shim, laser diode submount, substrates, base plate, flange, chip carrier, optical bench, etc.

Product picture:

Cu - W Semiconductor Substrate


Product Tags:

copper base plate

      

copper block heat sink

      
Quality Cu - W Semiconductor Substrate for sale

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