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Moly Copper Thermal Management Carrier Plates Heat Sink For IGBT Modules

Zhuzhou Jiabang Refractory Metal Co., Ltd
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Moly Copper Thermal Management Carrier Plates Heat Sink For IGBT Modules

Brand Name : JBNR

Model Number : 50MoCu,60MoCu,70MoCu,85MoCu

Place of Origin : CHINA

MOQ : Negotiation

Price : Negotiable

Payment Terms : L/C, , T/T, Western Union

Delivery Time : 15days

Packaging Details : as customer required

Material : Molybdenum copper

Density : 9.7

CTE : 10.3

TC : 210-250

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Moly Copper Thermal Management Carrier Plates For IGBT modules

Description:

These composite materials have copper content that can be modified to adapt the base plate’s thermal properties to the entire assembly. Since molybdenum-copper composites are lightweight, they are ideal for those applications where every gram is important. In the automotive industry, for instance, the composites are utilized as carrier plates in the IGBT modules. These modules function as inverters in electric drives.

Advantages:

High thermal conductivity due to no sintering additives were used
Excellent hermeticity
Relatively small density
Stampable sheets available (Mo content not more than 75wt.%)
Semi-finished or finished (Ni/Au plated) parts available

Product Properties:

Grade Mo Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
85MoCu 85±2% 10.0 7 160(25℃)/156(100℃)
70MoCu 70±2% 9.8 7 200(25℃)/196(100℃)
60MoCu 60±2% 9.66 7.5 222(25℃)/217(100℃)
50MoCu 50±2% 9.5 10.2 250(25℃)/220(100℃)

Application:

These composite are widely used in applications such as IGBT modules.Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.

Product picture:

Moly Copper Thermal Management Carrier Plates Heat Sink For IGBT Modules


Product Tags:

copper base plate

      

copper block heat sink

      
Quality Moly Copper Thermal Management Carrier Plates Heat Sink For IGBT Modules for sale

Moly Copper Thermal Management Carrier Plates Heat Sink For IGBT Modules Images

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