Home > Heat Sink >

Copper Molybdenum CuMo Heat Spreaders And Packaging Components For RF And Microwave Amplifiers

Product Categories

Hermetic Packages Electronics [97]
Heat Sink [90]
Welding Electrodes [56]
X-Ray Tube Target [12]
Tungsten Products [33]
Molybdenum Products [23]
Tungsten Heavy Alloy [28]
Copper Tungsten Alloy [53]
Tantalum Products [15]
Niobium Products [27]
Tungsten Carbide Products [49]
High Temperature Furnace Spare Parts [20]
Molybdenum Copper [24]

Zhuzhou Jiabang Refractory Metal Co., Ltd

Contact Now

Copper Molybdenum CuMo Heat Spreaders And Packaging Components For RF And Microwave Amplifiers

Name: Copper Molybdenum CuMo Heat Spreaders And Packaging Components For RF And Microwave Amplifiers
Brand: JBNR
Price: 1 USD

Quality Copper Molybdenum CuMo Heat Spreaders And Packaging Components For RF And Microwave Amplifiers for sale

Brand Name : JBNR

Model Number : 50MoCu,60MoCu,70MoCu,85MoCu

Place of Origin : CHINA

MOQ : Negotiation

Price : Negotiable

Payment Terms : L/C, , T/T, Western Union

Delivery Time : 25days

Packaging Details : as customer required

Material : Molybdenum copper

Density : 9.8

CTE : 7

TC : 190-200

Contact Now

Copper Molybdenum (CuMo) Heat Spreaders And Packaging Components For RF And Microwave Amplifiers

Description:

Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.

Advantages:

1. This molybdenum copper carrier/heat sink feature high thermal conductivity and excellent hermeticity.

2. Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.

Product Properties:

Grade	Mo Content	Density g/cm³	Coefficient of thermal Expansion ×10^-6(20℃)	Thermal conductivity W/(M·K)
85MoCu	85±2%	10.0	7	160(25℃)/156(100℃)
70MoCu	70±2%	9.8	7	200(25℃)/196(100℃)
60MoCu	60±2%	9.66	7.5	222(25℃)/217(100℃)
50MoCu	50±2%	9.5	10.2	250(25℃)/220(100℃)

Application:

Molybdenum copper composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of molybdenum, molybdenum copper has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion also make molybdenum copper alloy an excellent choice even for extremely dense circuits.

Product picture:

Copper Molybdenum CuMo Heat Spreaders And Packaging Components For RF And Microwave Amplifiers

Product Tags:

copper base plate

copper block heat sink

Copper Molybdenum CuMo Heat Spreaders And Packaging Components For RF And Microwave Amplifiers Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Zhuzhou Jiabang Refractory Metal Co., Ltd
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!