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Cu/Mo/Cu Carrier Hermetic Packages Electronics Material CMC Flange

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Zhuzhou Jiabang Refractory Metal Co., Ltd

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Cu/Mo/Cu Carrier Hermetic Packages Electronics Material CMC Flange

Name: CuMoCu Carrier Hermetic Packages Electronics Material CMC Flange
Brand: JBNR
Price: 1 USD

Brand Name : JBNR

Model Number : CMC111,CMC121,CMC131,CMC141,CMC13/74/13

Place of Origin : CHINA

Payment Terms : L/C, , T/T, Western Union

Delivery Time : 15days

Packaging Details : as customer required

Material : copper/moly/copper

Density : 9.66

CTE : 6.8

TC : 190

MOQ : Negotiation

Price : Negotiable

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Cu/Mo/Cu carrier Hermetic Packages Electronics Material CMC Flange

Description:

Cu/Mo/Cu(CMC) carrier, also known as CMC alloy, is a sandwich structured and flat-panel composite material. It uses pure molybdenum as the core material, and is covered with pure copper or dispersion strengthened copper on both sides. Besides, copper molybdenum copper heat sink has adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability.

Advantages:

1.Can be stamped into components
2.Strong interface bonding resist to 850℃ heat shock repeatedly
3.High thermal conductivity

Product Properties:

Grade	Density g/cm³	Coefficient of thermal Expansion ×10^-6(20℃)	Thermal conductivity W/(M·K)
CMC111	9.32	8.8	305(XY)/250(Z)
CMC121	9.54	7.8	260(XY)/210(Z)
CMC131	9.66	6.8	244(XY)/190(Z)
CMC141	9.75	6.0	220(XY)/180(Z)
CMC13/74/13	9.88	5.6	200(XY)/170(Z)

Application:

Cu/Mo/Cu(CMC) heat sink has similar applications with tungsten copper heat sinks. It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.

Product picture:

Cu/Mo/Cu Carrier Hermetic Packages Electronics Material CMC Flange

Product Tags:

molybdenum copper heat spreaders

tungsten copper heat spreader

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