High Thermal Conductivity Molybdenum Copper Flange For Rf Device Package Flange

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Zhuzhou Jiabang Refractory Metal Co., Ltd

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High Thermal Conductivity Molybdenum Copper Flange For Rf Device Package Flange

Name: High Thermal Conductivity Molybdenum Copper Flange For Rf Device Package Flange
Brand: JBNR
Price: 1 USD

Brand Name : JBNR

Model Number : 50MoCu,60MoCu,70MoCu,85MoCu

Place of Origin : CHINA

Payment Terms : L/C, , T/T, Western Union

Delivery Time : 15days

Packaging Details : as customer required

Material : Molybdenum copper

Density : 9.66

CTE : 7.5

TC : 220

MOQ : Negotiation

Price : Negotiable

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MOLYBDENUM COPPER FLANGE FOR HERMETIC PACKAGES ELECTRONICS RF DEVICE PACKAGE FLANGE

Description:

Molybdenum Copper composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.

Advantages:

1. This molybdenum copper flange feature high thermal conductivity and excellent hermeticity.

2. Molybdenum copper flange is much lighter than comparable tungsten copper composite,so it is more suitable for aerospace and other field.

Product Properties:

Grade	Mo Content	Density g/cm³	Coefficient of thermal Expansion ×10^-6(20℃)	Thermal conductivity W/(M·K)
85MoCu	85±2%	10.0	7	160(25℃)/156(100℃)
70MoCu	70±2%	9.8	7	200(25℃)/196(100℃)
60MoCu	60±2%	9.66	7.5	222(25℃)/217(100℃)
50MoCu	50±2%	9.5	10.2	250(25℃)/220(100℃)

Application:

These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.

Product picture:

High Thermal Conductivity Molybdenum Copper Flange For Rf Device Package Flange

Product Tags:

molybdenum copper heat spreaders

copper molybdenum heat base

Quality High Thermal Conductivity Molybdenum Copper Flange For Rf Device Package Flange for sale

High Thermal Conductivity Molybdenum Copper Flange For Rf Device Package Flange Images

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