LDMOS RF Transistor Hermetic Packaging Cu / Mo / Cu Flanges With Good Heat Dissipation

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Zhuzhou Jiabang Refractory Metal Co., Ltd

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LDMOS RF Transistor Hermetic Packaging Cu / Mo / Cu Flanges With Good Heat Dissipation

Name: LDMOS RF Transistor Hermetic Packaging Cu Mo Cu Flanges With Good Heat Dissipation
Brand: JBNR
Price: 1 USD

Brand Name : JBNR

Model Number : CMC111,CMC121,CMC131,CMC141,CMC13/74/13

Place of Origin : CHINA

Payment Terms : L/C, , T/T, Western Union

Delivery Time : 15days

Packaging Details : as customer required

Material : copper/moly/copper

Density : 9.75

CTE : 6.0

TC : 180-220

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LDMOS RF Transistor Cu/Mo/Cu Flanges With Good Heat Dissipation

Description:

Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.

Advantages:

1.Can be stamped into components
2.Strong interface bonding resist to 850℃ heat shock repeatedly
3.High thermal conductivity

Product Properties:

Grade	Density g/cm³	Coefficient of thermal Expansion ×10^-6(20℃)	Thermal conductivity W/(M·K)
CMC111	9.32	8.8	305(XY)/250(Z)
CMC121	9.54	7.8	260(XY)/210(Z)
CMC131	9.66	6.8	244(XY)/190(Z)
CMC141	9.75	6	220(XY)/180(Z)
CMC13/74/13	9.88	5.6	200(XY)/170(Z)

Application:

Cu/Mo/Cu(CMC) carrier has similar applications with tungsten copper heat sinks. It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.

Product picture:

LDMOS RF Transistor Hermetic Packaging Cu / Mo / Cu Flanges With Good Heat Dissipation

Product Tags:

tungsten copper heat spreader

copper molybdenum heat base

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