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High Thermal Expansion Mocu Flanges Light Weight With Excellent Hermeticity

Zhuzhou Jiabang Refractory Metal Co., Ltd
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High Thermal Expansion Mocu Flanges Light Weight With Excellent Hermeticity

Brand Name : JBNR

Model Number : HCMC001

Certification : ISO9001

Place of Origin : China

MOQ : Negotiation

Payment Terms : L/C, D/A, D/P, T/T, Western Union

Supply Ability : 5 tons a month

Delivery Time : 20 days

Packaging Details : Wooden boxes

Grade : Mo80Cu20, Mo75C25, Mo70Cu30, Mo60Cu40,Mo50Cu50

Surface : Plated or unplated

Dimensions : Based on customer requirements

Plating : Nickel plating or gold plaing

Shape : Shims or sheets or fabricated parts

Price : Negotiable

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High Thermal Expansion Mocu Flanges For Microwave Packages In Microelectro

Description:

Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper. Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.

Advantages:

1. This molybdenum copper base plates feature high thermal conductivity and excellent hermeticity.

2. Molybdenum copper flanges are 40% lighter than comparable tungsten copper composite.

Product Properties:

Grade Mo Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
70MoCu 70±2% 9.8 7 200(25℃)/196(100℃)
60MoCu 60±2% 9.66 7.5 222(25℃)/217(100℃)
50MoCu 50±2% 9.5 10.2 250(25℃)/220(100℃)

Application:

Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.


Product Tags:

molybdenum copper heat spreaders

      

copper molybdenum heat base

      
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