Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials

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Zhuzhou Jiabang Refractory Metal Co., Ltd

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Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials

Name: Copper Tungsten WCu CuW Molybdenum Copper MoCu CuMo Electronic Packaging Materials
Brand: JBNR
Price: 1 USD

Quality Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials for sale

Brand Name : JBNR

Model Number : 50WCu,60WCu,70WCu,85WCu

Place of Origin : CHINA

MOQ : Negotiation

Price : Negotiable

Payment Terms : L/C, , T/T, Western Union

Supply Ability : 1000000pcs per month

Delivery Time : 25days

Packaging Details : as customer required

Material : tungsten copper

Density : 16.4

CTE : 7.2

TC : 180-190

Brand : JBNR

Application : Electronic Packaging

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Copper Tungsten (WCu/CuW) / Molybdenum Copper (MoCu/CuMo) / Copper Molybdenum Electronic Packaging Materials

Description:

Copper Tungsten are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.
Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable coefficient of thermal expansion and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper.Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.

Advantages:
1. High thermal conductivity
2. Excellent hermeticity
3. Stampable sheets available
4. Semi-finished or finished (Ni/Au/Ag/NiPd/Au plated) products available
5. Low void

Product Properties:

Grade	W Content	Density g/cm³	Coefficient of thermal Expansion ×10^-6(20℃)	Thermal conductivity W/(M·K)
90WCu	90±2%	17.0	6.5	180 (25℃) /176 (100℃)
85WCu	85±2%	16.4	7.2	190 (25℃) / 183 (100℃)
80WCu	80±2%	15.65	8.3	200 (25℃) / 197 (100℃)
75WCu	75±2%	14.9	9.0	230 (25℃) / 220 (100℃)
50WCu	50±2%	12.2	12.5	340 (25℃) / 310 (100℃)

Grade	Mo Content	Density g/cm³	Coefficient of thermal Expansion ×10^-6(20℃)	Thermal conductivity W/(M·K)
85MoCu	85±2%	10.0	7	160(25℃)/156(100℃)
70MoCu	70±2%	9.8	7	200(25℃)/196(100℃)
60MoCu	60±2%	9.66	7.5	222(25℃)/217(100℃)
50MoCu	50±2%	9.5	10.2	250(25℃)/220(100℃)

Application:

Our products are widely used in applications such as heat sink, heat spreader, shim, laser diode submount, substrates, base plate, flange, chip carrier, optical bench, etc.

Product picture:

Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials

Product Tags:

tungsten copper heat spreader

copper molybdenum heat base

Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials Images

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