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Brand Name : JBNR
Model Number : 50MoCu,60MoCu,70MoCu,85MoCu
Certification : ISO9001
Place of Origin : CHINA
MOQ : Negotiation
Price : Negotiable
Payment Terms : L/C, , T/T, Western Union
Delivery Time : 25days
Packaging Details : as customer required
Material : Molybdenum copper
Density : 10
CTE : 7
TC : 160-200
Plating : Nickel and gold
name : electronic packaging materials
Molybdenum Copper Heat Sink For High Power RF, Microwave, Semiconductor Packaging, Optical Communication
Description:
Mo-Cu composite is similar with Tungsten-copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-cu.
Advantages:
1. This molybdenum copper carrier/heat sink feature high thermal conductivity and excellent hermeticity.
2. Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.
Product Properties:
Grade | Mo Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
85MoCu | 85±2% | 10.0 | 7 | 160(25℃)/156(100℃) |
70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
These composite are widely used in applications, such as optoelectronics packages Microwave Packages, C Packages, Laser Sub-mounts, etc
Product picture:
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Molybdenum Copper Heat Sink Hermetic Packages Electronics For Optical Communication Images |