Home > Heat Sink >

Cu / Mo70Cu / Cu CPC Mocu Heat Sink And Shims For High Power Device

Product Categories

Hermetic Packages Electronics [97]
Heat Sink [90]
Welding Electrodes [56]
X-Ray Tube Target [12]
Tungsten Products [33]
Molybdenum Products [23]
Tungsten Heavy Alloy [28]
Copper Tungsten Alloy [53]
Tantalum Products [15]
Niobium Products [27]
Tungsten Carbide Products [49]
High Temperature Furnace Spare Parts [20]
Molybdenum Copper [24]

Zhuzhou Jiabang Refractory Metal Co., Ltd

Contact Now

Cu / Mo70Cu / Cu CPC Mocu Heat Sink And Shims For High Power Device

Name: Cu Mo70Cu Cu CPC Mocu Heat Sink And Shims For High Power Device
Brand: JBNR
Price: 1 USD

Quality Cu / Mo70Cu / Cu CPC Mocu Heat Sink And Shims For High Power Device for sale

Brand Name : JBNR

Model Number : CPC141,CPC232,CPC300

Place of Origin : CHINA

MOQ : Negotiation

Price : Negotiable

Payment Terms : L/C, , T/T, Western Union

Delivery Time : 15days

Packaging Details : as customer required

Material : copper/moly copper/copper

Density : 9.2

CTE : 9.5

TC : 260

Application : RF Power Device Package

Contact Now

Cu / Mo70Cu / Cu (CPC) Heat Sinks and Shims For High Power Device

Description:

Cu/Mo70Cu/Cu is a sandwich composite similar to that of Cu/Mo/Cu with a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu: Mo-Cu: Cu is 1: 4: 1. It has different CTE in X and Y direction, with higher thermal conductivity than that of W(Mo)Cu &Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.

Advantages:
1.More easily to be stamped into components than CMC
2.Very strong interface bonding which can repeatedly resist 850℃ heat shock
3.Higher thermal conductivity and lower cost

4.No magnetism

Product Properties:

Grade

Density g/cm³

Coefficient of thermal

Expansion ×10^-6(20℃)

Coefficient of thermal

Expansion ×10^-6(20℃)

CPC141

9.5

7.3

280(XY)/170(Z)

CPC232

9.3

10.2

255(XY)/250(Z)

Application:
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mount,mobile phone base stations.

Product picture:

Cu / Mo70Cu / Cu CPC Mocu Heat Sink And Shims For High Power Device

Product Tags:

copper base plate

copper block heat sink

Cu / Mo70Cu / Cu CPC Mocu Heat Sink And Shims For High Power Device Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Zhuzhou Jiabang Refractory Metal Co., Ltd
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!