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Nickel Plated 70MoCu Electronic Packaging Materials And Heat Sink For RF / MV Packages

Zhuzhou Jiabang Refractory Metal Co., Ltd
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Nickel Plated 70MoCu Electronic Packaging Materials And Heat Sink For RF / MV Packages

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Brand Name : JBNR

Model Number : 50MoCu,60MoCu,70MoCu,85MoCu

Place of Origin : CHINA

MOQ : Negotiation

Price : Negotiable

Payment Terms : L/C, , T/T, Western Union

Delivery Time : 15days

Packaging Details : as customer required

Material : Molybdenum copper

Density : 9.8

CTE : 9.1

TC : 180-200

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Nickel Plated 70MoCu Electronic Packaging Materials And Heat Sink For RF / MV Packages

Description:

It is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter than W-Cu, so that it is more suitable for aeronautic and astronautic applications.

Advantages:

High thermal conductivity due to no sintering additives were used
Excellent hermeticity
Relatively small density
Stampable sheets available (Mo content not more than 75wt.%)
Semi-finished or finished (Ni/Au plated) parts available

Product Properties:

Grade Mo Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
85MoCu 85±2% 10.0 7 160(25℃)/156(100℃)
70MoCu 70±2% 9.8 7 200(25℃)/196(100℃)
60MoCu 60±2% 9.66 7.5 222(25℃)/217(100℃)
50MoCu 50±2% 9.5 10.2 250(25℃)/220(100℃)

Application:

These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.

Product picture:

Nickel Plated 70MoCu Electronic Packaging Materials And Heat Sink For RF / MV Packages


Product Tags:

copper base plate

      

copper block heat sink

      
Quality Nickel Plated 70MoCu Electronic Packaging Materials And Heat Sink For RF / MV Packages for sale

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