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CPC Cu / Mo70Cu / Cu Amplifier Substrate For 5G Wireless Mobile Phone Base Stations

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Zhuzhou Jiabang Refractory Metal Co., Ltd

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CPC Cu / Mo70Cu / Cu Amplifier Substrate For 5G Wireless Mobile Phone Base Stations

Name: CPC Cu Mo70Cu Cu Amplifier Substrate For 5G Wireless Mobile Phone Base Stations
Brand: JBNR
Price: 1 USD

Quality CPC Cu / Mo70Cu / Cu Amplifier Substrate For 5G Wireless Mobile Phone Base Stations for sale

Brand Name : JBNR

Model Number : CPC141,CPC232,CPC300

Place of Origin : CHINA

MOQ : Negotiation

Price : Negotiable

Payment Terms : L/C, , T/T, Western Union

Delivery Time : 15days

Packaging Details : as customer required

Material : copper/moly copper/copper

Density : 9.5

CTE : 7.3

TC : 170

Application : RF Power Device Package

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CPC (Cu/Mo70Cu/Cu) Amplifier Substrate For 5G Wireless Mobile Phone Base Stations

Description:

Cu/Mo70Cu/Cu (CPC) is a sandwiched composite similar to Cu/Mo/Cu comprising a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu Mo70Cu and Cu layers is 1:4:1. It has different CTEs in the X and the Y direction. Its thermal conductivity is higher than those of W/Cu, Mo/Cu, Cu/Mo/Cu and it is much cheaper.

Advantages:
1.More easily to be stamped into components than CMC
2.Very strong interface bonding which can repeatedly resist 850℃ heat shock
3.Higher thermal conductivity and lower cost

4.No magnetism

Product Properties:

Grade

Density g/cm³

Coefficient of thermal

Expansion ×10^-6(20℃)

Coefficient of thermal

Expansion ×10^-6(20℃)

CPC141

9.5

7.3

280(XY)/170(Z)

CPC232

9.3

10.2

255(XY)/250(Z)

Application:
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mount,mobile phone base stations.

Product picture:

CPC Cu / Mo70Cu / Cu Amplifier Substrate For 5G Wireless Mobile Phone Base Stations

Product Tags:

copper base plate

copper block heat sink

CPC Cu / Mo70Cu / Cu Amplifier Substrate For 5G Wireless Mobile Phone Base Stations Images

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