WCu Material / Tungsten Copper Heat Sink Nickel Plated For Laser Diode Submounts
Description:
It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be disigned by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO),Semiconductors (Si),Metals (Kovar), etc. The products are widely applicated in the fields such as radio frequency,microwave,high power diode packaging and optical communication system.
Advantages:
1. High thermal conductivity
2. Excellent hermeticity
3. Excellent flatness, surface finish, and size control
4. Semi-finished or finished (Ni/Au plated) products available
5. Low void
Product Properties:
| Grade | W Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
| 90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
| 85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
| 80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
| 75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
| 50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
Application:
1.Used as high temperature resistance in electronic products and Auto-Engines. Like Computer generates vast amounts of heat, which results in the slow of speed.Tungsten alloy heat sink can solve this problem.
2.Used in applications such as optoelectronics packages, Microwave Packages, Packages, Laser Submounts, etc.
3.Used as heat sink pieces and encapsulation shell.
4.Used in thermal mounting plates, chip carriers, flanges, and frames for RF, microwave millimeter wave packages like LDMOS FET; MSFET; HBT; Bipolar; HEMT; MMIC, light emitting diodes and detectors, laser diode packages like pulse, CW, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable Lasers.
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