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MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate

Zhuzhou Jiabang Refractory Metal Co., Ltd
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MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate

Brand Name : JBNR

Model Number : 50MoCu,60MoCu,70MoCu,85MoCu

Place of Origin : CHINA

MOQ : Negotiation

Price : Negotiable

Payment Terms : L/C, , T/T, Western Union

Delivery Time : 25days

Packaging Details : as customer required

Material : Molybdenum copper

Density : 10

CTE : 6.8

TC : 160-180

Plating : Nickel and Gold

Application : RF and microwave amplifiers

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MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate

Description:

Mo-Cu heat sink material is a composite of molybdenum and copper,the Coefficient of thermal expansion (CTE) of molybdenum copper can be tailored by adjusting the composition, which is the same way with tungsten copper composites. MoCu is much lighter than tungsten cooper, which make it more suitable for aerospace usage.

Advantages:

High thermal conductivity since no sintering additives have been used

Excellent hermeticity

Relatively small density

Stampable sheets available (Mo content no more than 75 wt%)

Semi-finished or finished (Ni/Au plated) parts available

Product Properties:

Grade Mo Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
85MoCu 85±2% 10.0 7 160(25℃)/156(100℃)
70MoCu 70±2% 9.8 7 200(25℃)/196(100℃)
60MoCu 60±2% 9.66 7.5 222(25℃)/217(100℃)
50MoCu 50±2% 9.5 10.2 250(25℃)/220(100℃)

Application:

These composite are widely used in applications such as IGBT modules,Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.

Product picture:

MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate


Product Tags:

tungsten copper heat spreader

      

copper molybdenum heat base

      
Quality MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate for sale

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