High Power Semiconductor Molybdenum Copper Heatsinks State Of Art Powder Metal Technology

Product Categories

Hermetic Packages Electronics [97]
Heat Sink [90]
Welding Electrodes [56]
X-Ray Tube Target [12]
Tungsten Products [33]
Molybdenum Products [23]
Tungsten Heavy Alloy [28]
Copper Tungsten Alloy [53]
Tantalum Products [15]
Niobium Products [27]
Tungsten Carbide Products [49]
High Temperature Furnace Spare Parts [20]
Molybdenum Copper [24]

Zhuzhou Jiabang Refractory Metal Co., Ltd

Contact Now

High Power Semiconductor Molybdenum Copper Heatsinks State Of Art Powder Metal Technology

Name: High Power Semiconductor Molybdenum Copper Heatsinks State Of Art Powder Metal Technology
Brand: JBNR
Price: 1 USD

Brand Name : JBNR

Model Number : HCMC012

Certification : ISO9001

Place of Origin : China

MOQ : 10pcs

Price : Negotiable

Payment Terms : L/C, D/A, D/P, T/T, Western Union

Supply Ability : 5 tons a month

Delivery Time : 15-20 days

Packaging Details : Wooden boxes

Grade : Mo85Cu15, Mo80Cu20, Mo75C25, Mo70Cu30, Mo60Cu40,Mo50Cu50

Surface : Grinded or lathed

Dimensions : Based on customer requirements

Plating : Nickel plating or gold plaing

Shape : Shims or sheets or fabricated parts

Contact Now

State-of-the-art Powder Metal Technology For High Power Semiconductor Molybdenum Copper Heatsinks

Description:

With adjustable thermal expansion coefficient and thermal conductivity, Molybdenum Copper Heat sink (MoCu) is a suitable material for heat cooling in microelectronic industry. And the density of molybdenum copper is equal or below 10.01 which is much smaller than that of tungsten copper.

For some specific industry like automobile and aerospace, Molybdenum Copper Heatsinks is a better choice.

Advantages:

1. high thermal conductivity and excellent hermeticity.

2. 40% lighter weight compared to WCu materials.

Product Properties:

Grade	Mo Content	Density g/cm³	Coefficient of thermal Expansion ×10^-6(20℃)	Thermal conductivity W/(M·K)
85MoCu	85±2%	10.01	7	200(25℃)/156(100℃)
80MoCu	80±2%	9.9	7	170(25℃)/190(100℃)
70MoCu	70±2%	9.8	7.3	200(25℃)/196(100℃)
60MoCu	60±2%	9.66	8.4	222(25℃)/217(100℃)
50MoCu	50±2%	9.5	10.2	250(25℃)/220(100℃)

Application:

Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

Product Tags:

molybdenum element

mocu heat sink

Quality High Power Semiconductor Molybdenum Copper Heatsinks State Of Art Powder Metal Technology for sale

High Power Semiconductor Molybdenum Copper Heatsinks State Of Art Powder Metal Technology Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Zhuzhou Jiabang Refractory Metal Co., Ltd
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!