Ultra-pure Low Density Heat Dissipating Mo/cu Laminates In High-power Transistors
Description:
Consisting of ultra-pure molybdenum with OFC in 30% weight,molybdenum copper composite has the properties of higher thermal conductivity and lower density compared with pure molybdenum. Nowadays the electronic components is getting smaller and also requires greater power densities.
By using our moly copper carriers, you could receive efficent cooling effect and outstanding service life.
What we can offer:
1. With years of powder metalurgy experience, we can make very even grain size. And the material has no pores in inner structure.
This can ensure the material has good hermeticity.
2. For different materials, we have ways of surface dealing to make sure the surface is good for your own plating.
3. We can offer all kinds of plating, including nickel plating, gold plating or Ag plating. If you wanna your carriers to be plated, you can let us know.
Product Properties:
| Grade | Mo Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.
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