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CPC Heat Sink Hermetic Packages Electronics For RF And Microwave Amplifier

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Zhuzhou Jiabang Refractory Metal Co., Ltd

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CPC Heat Sink Hermetic Packages Electronics For RF And Microwave Amplifier

Name: CPC Heat Sink Hermetic Packages Electronics For RF And Microwave Amplifier
Brand: JBNR
Price: 1 USD

Quality CPC Heat Sink Hermetic Packages Electronics For RF And Microwave Amplifier for sale

Brand Name : JBNR

Model Number : CPC141,CPC232,CPC300

Place of Origin : CHINA

Payment Terms : L/C, , T/T, Western Union

Delivery Time : 15days

Packaging Details : as customer required

Material : copper/moly copper/copper

Density : 9.5

CTE : 7.3

TC : 170

MOQ : Negotiation

Price : Negotiable

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CPC Heat Sink / Carrier / Submount / Flange For RF And Microwave Amplifier / Transistor / TR Moudle

Description:

CPC is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu: Mo-Cu: Cu is 1:4:1. It has different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components,.

Advantages:

1.More easily to be stamped into components than CMC
2.Very strong interface bonding which can repeatedly resist 850℃ heat shock
3.Higher thermal conductivity and lower cost

4.No magnetism

Product Properties:

Grade

Density g/cm³

Coefficient of thermal

Expansion ×10^-6(20℃)

Coefficient of thermal

Expansion ×10^-6(20℃)

CPC141

9.5

7.3

280(XY)/170(Z)

CPC232

9.3

10.2

255(XY)/250(Z)

Application:

It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.

Product picture:

CPC Heat Sink Hermetic Packages Electronics For RF And Microwave Amplifier

Product Tags:

molybdenum copper heat spreaders

copper molybdenum heat base

CPC Heat Sink Hermetic Packages Electronics For RF And Microwave Amplifier Images

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