Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging

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Zhuzhou Jiabang Refractory Metal Co., Ltd

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Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging

Name: Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging
Brand: JBNR
Price: 1 USD

Quality Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging for sale

Brand Name : JBNR

Model Number : HCMC008

Certification : ISO9001

Place of Origin : China

MOQ : Negotiation

Payment Terms : L/C, D/A, D/P, T/T, Western Union

Supply Ability : 5 tons a month

Delivery Time : 20 days

Packaging Details : Wooden boxes

Grade : Mo80Cu20, Mo75C25, Mo70Cu30, Mo60Cu40,Mo50Cu50

Surface : Plated or unplated

Dimensions : Based on customer requirements

Plating : Nickel plating and gold plaing

Shape : Shims or sheets or fabricated parts

Price : Negotiable

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Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging

Description:

Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper. Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.

Advantages:

1. This molybdenum copper base plates feature high thermal conductivity and excellent hermeticity.

2. Molybdenum copper flanges are 40% lighter than comparable tungsten copper composite.

Product Properties:

Grade	Mo Content	Density g/cm³	Coefficient of thermal Expansion ×10^-6(20℃)	Thermal conductivity W/(M·K)
70MoCu	70±2%	9.8	7	200(25℃)/196(100℃)
60MoCu	60±2%	9.66	7.5	222(25℃)/217(100℃)
50MoCu	50±2%	9.5	10.2	250(25℃)/220(100℃)

Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging

Application:

Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

Product Tags:

tungsten copper heat spreader

copper molybdenum heat base

Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging Images

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