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Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip

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Zhuzhou Jiabang Refractory Metal Co., Ltd

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Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip

Name: Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip
Brand: JBNR
Price: 1 USD

Quality Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip for sale

Brand Name : JBNR

Model Number : HCMC024

Certification : ISO9001

Place of Origin : China

MOQ : 10pcs

Price : Negotiable

Payment Terms : L/C, D/A, D/P, T/T, Western Union

Supply Ability : 5 tons a month

Delivery Time : 15-20 days

Packaging Details : Wooden boxes

Grade : Mo85Cu15, Mo80Cu20, Mo75C25, Mo70Cu30, Mo60Cu40,Mo50Cu50

Surface : Grinded or lathed

Dimensions : Based on customer requirements

Plating : Nickel plating or gold plaing

Shape : Shims or sheets or fabricated parts

Other : If required, we can offer silver plating

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Thermal Buffer Molybdenum Copper Substrate Welded To DBC On Chip

Description:

With adjustable thermal expansion coefficient and thermal conductivity, Molybdenum Copper Heat sink (MoCu) is a suitable material for heat cooling in microelectronic industry. And the density of molybdenum copper is equal or below 10.01 which is much smaller than that of tungsten copper.

For some specific industry like automobile and aerospace, Molybdenum Copper Heatsinks is a better choice.

Customers normally choose moly copper as heat sink and then they will weld DBC onto the heat sink.

Advantages:

1. high thermal conductivity and excellent hermeticity.

2. 40% lighter weight compared to WCu materials.

Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip

Product Properties:

Grade	Mo Content	Density g/cm³	Coefficient of thermal Expansion ×10^-6(20℃)	Thermal conductivity W/(M·K)
85MoCu	85±2%	10.01	7	200(25℃)/156(100℃)
80MoCu	80±2%	9.9	7	170(25℃)/190(100℃)
70MoCu	70±2%	9.8	7.3	200(25℃)/196(100℃)
60MoCu	60±2%	9.66	8.4	222(25℃)/217(100℃)
50MoCu	50±2%	9.5	10.2	250(25℃)/220(100℃)

Application:

Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

Product Tags:

molybdenum element

mocu heat sink

Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip Images

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