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Molybdenum Copper Heat Sink Hermetic Packages Electronics For Optical Communication

Zhuzhou Jiabang Refractory Metal Co., Ltd
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Molybdenum Copper Heat Sink Hermetic Packages Electronics For Optical Communication

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Brand Name : JBNR

Model Number : 50MoCu,60MoCu,70MoCu,85MoCu

Certification : ISO9001

Place of Origin : CHINA

MOQ : Negotiation

Price : Negotiable

Payment Terms : L/C, , T/T, Western Union

Delivery Time : 25days

Packaging Details : as customer required

Material : Molybdenum copper

Density : 10

CTE : 7

TC : 160-200

Plating : Nickel and gold

name : electronic packaging materials

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Molybdenum Copper Heat Sink For High Power RF, Microwave, Semiconductor Packaging, Optical Communication

Description:

Mo-Cu composite is similar with Tungsten-copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-cu.

Advantages:

1. This molybdenum copper carrier/heat sink feature high thermal conductivity and excellent hermeticity.

2. Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.

Product Properties:

Grade Mo Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
85MoCu 85±2% 10.0 7 160(25℃)/156(100℃)
70MoCu 70±2% 9.8 7 200(25℃)/196(100℃)
60MoCu 60±2% 9.66 7.5 222(25℃)/217(100℃)
50MoCu 50±2% 9.5 10.2 250(25℃)/220(100℃)

Application:

These composite are widely used in applications, such as optoelectronics packages Microwave Packages, C Packages, Laser Sub-mounts, etc

Product picture:

Molybdenum Copper Heat Sink Hermetic Packages Electronics For Optical Communication


Product Tags:

tungsten copper heat spreader

      

copper molybdenum heat base

      
Quality Molybdenum Copper Heat Sink Hermetic Packages Electronics For Optical Communication for sale

Molybdenum Copper Heat Sink Hermetic Packages Electronics For Optical Communication Images

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